(module QFN-20-1EP_4x4mm_Pitch0.5mm_Handsoldering (layer F.Cu) (tedit 59CD5A0D)
  (descr "20-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "QFN 0.5")
  (attr smd)
  (fp_text reference REF** (at 0 -3.33) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value QFN-20-1EP_4x4mm_Pitch0.5mm (at 0 3.33) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -1 -2) (end 2 -2) (layer F.Fab) (width 0.15))
  (fp_line (start 2 -2) (end 2 2) (layer F.Fab) (width 0.15))
  (fp_line (start 2 2) (end -2 2) (layer F.Fab) (width 0.15))
  (fp_line (start -2 2) (end -2 -1) (layer F.Fab) (width 0.15))
  (fp_line (start -2 -1) (end -1 -2) (layer F.Fab) (width 0.15))
  (fp_line (start -2.6 -2.6) (end -2.6 2.6) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.6 -2.6) (end 2.6 2.6) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.6 -2.6) (end 2.6 -2.6) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.6 2.6) (end 2.6 2.6) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.15 -2.15) (end 2.15 -1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.15 2.15) (end -2.15 1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.15 2.15) (end 2.15 1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.15 -2.15) (end -1.375 -2.15) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.15 2.15) (end -1.375 2.15) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.15 2.15) (end 1.375 2.15) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.15 -2.15) (end 1.375 -2.15) (layer F.SilkS) (width 0.15))
  (pad 1 smd rect (at -2.115 -1) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.115 -0.5) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.115 0) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.115 0.5) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -2.115 1) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -1 2.115 90) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -0.5 2.115 90) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 0 2.115 90) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 0.5 2.115 90) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 1 2.115 90) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 2.115 1) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 2.115 0.5) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 2.115 0) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 2.115 -0.5) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at 2.115 -1) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd rect (at 1 -2.115 90) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at 0.5 -2.115 90) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 18 smd rect (at 0 -2.115 90) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 19 smd rect (at -0.5 -2.115 90) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 20 smd rect (at -1 -2.115 90) (size 1 0.3) (layers F.Cu F.Paste F.Mask))
  (pad EP smd rect (at 0 0) (size 2.5 2.5) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad EP thru_hole circle (at 0 0 90) (size 2.25 2.25) (drill 1.75) (layers *.Cu *.Mask))
  (model Housings_DFN_QFN.3dshapes/QFN-20-1EP_4x4mm_Pitch0.5mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)